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ABOUT
U. S. SENSOR
U.S.
SENSOR CORP.
U.S. Sensor is a world class
manufacturer of an extensive variety of the highest quality NTC
thermistors as well as thermistor probes
and assemblies. The company’s products are produced using
proprietary state of the art processing techniques which results in
excellent long term reliability. Product line also includes Thin Film
Platinum RTDs and RTD assemblies.
Customers world-wide use U.S. Sensor thermistors and RTDs in their most
demanding applications.
LEADING
EDGE TECHNOLOGY
To assure that U.S. Sensor maintains its competitive position in the market
place and continues to provide products which exceed its customers specified
requirements, the company continues to make substantial investments in
the most advanced component manufacturing equipment as well as in research
and development of innovative products and manufacturing processes.
PRODUCTS
DESIGNED FROM THE GROUND UP
U.S. Sensor Corp. manufactures thermistors by preparing
precise formulations of powdered transition metal oxides "doped" with
stabilizing agents. These compounds are combined with binder materials
and processed using proprietary techniques resulting in superior quality
components and assemblies.
APPLICATION
ENGINEERING
U.S. Sensor's application engineering personnel are highly trained professionals
who will assist you to select a standard thermistor or design a special
device for your most exacting requirement. Whether your application requires
a simple component, a probe assembly or a complex network which will exhibit
non standard resistance temperature characteristics particularly suited
to your requirements, our application engineering personnel will be most
helpful. U.S. Sensor personnel have been designing unique devices for
the most demanding applications for more than thirty years.
QUALITY
SPC (statistical process control) techniques are used throughout the manufacturing
processes in an endless loop of quality improvement. Total Quality Management
is our pledge.
MANUFACTURING
PROCESSES
U.S. Sensor manufactures thermistors using sophisticated state of the
art processing techniques. Their excellent long term stability coupled
with precision interchangeability and low cost makes them ideally suited
for temperature sensing applications. The devices are available in a wide
variety of styles designed to suit countless circuit requirements.
NTC
MANUFACTURING PROCESSES
NTC thermistors are manufactured using homogeneous compounds of various
metal oxides including Manganese, Nickel, Cobalt and Copper. The powdered
metal oxides, along with stabilizing agents and organic binders, are combined
into exact formulations which will exhibit certain electrical characteristics
upon completion of the manufacturing processes. Dependent upon the particular
application for which the devices are to be used, the oxide/binder formulation
is formed into any number of shapes including chips, discs, wafers and
bars.
CHIPS
Precision interchangeable thermistors used for temperature measurement
and control as well as glass encapsulated and surface mount devices typically
utilize a small chip thermistor sensing element. A slurry, consisting
of the metal oxide compounds and special organic binders, is "cast" onto
a flat surface to exacting dimensions. The thickness of the "cast tape"
can be as thin as 0.001" or as thick as .050" depending upon the application.
The "cast tape" ware is "blanked" into wafers or substrates of a suitable
size. The "green" wafers are sintered at high temperature and electroded
with silver or other electrode materials.
The electroded
wafers are diced into the exact size dictated by the particular application.
A typical wafer will yield from 2,000 to 20,000 devices depending upon the
size of the chips required. The chips are
tested electrically, lead wires are attached, resistance trimming is performed
if necessary and an encapsulant is applied. In some applications the "unleaded"
bare chip can be used "as is". Chips can also be encapsulated in a hermetically
sealed (DO-35) style leaded glass package or into a "MELF" style surface
mount package.
DISCS
For production of large disc thermistors as well as power thermistors, those
devices used primarily for inrush current limiting in switching mode power
supplies, discs ranging in size from 0.200" diameter to over 1.000" diameter
are formed from the oxide/binder formulation using a tabletting press. Precise
quantities of powder are automatically metered into a die cavity and compacted
into a shape which conforms to the specified dimensional characteristics.
This process results in uniform density throughout the device as well as
uniform electrical characteristics throughout the production run. The "green"
discs are then subjected to a high temperature sintering process which will
result in the device achieving the desired resistance versus temperature
characteristics. The "sintered" discs are then metallized. A thick film
silver electrode material is applied to the "flats" of the discs and fired
to allow for subsequent electrical contact to the device. Testing of the
thermistor's electrical characteristics is performed to confirm that the
devices conform to the desired resistance versus temperature characteristic.
Lead wires are attached using specially formulated solder and an encapsulant
of epoxy or silicone resin is usually applied to the device for environmental
protection.
PROBES
AND ASSEMBLIES
Most of the standard thermistors and RTDs located in our web site are available
mounted in special probe housings designed for sensing temperature under
the most demanding environmental conditions. U.S. Sensor's standard probe
housings range in size from less than 0.020" diameter to over 0.375" diameter
and are constructed from various materials including stainless steel,
aluminum, epoxy, polyimide and PVC just to name a few. Detailed descriptions
of some of U.S. Sensor's standard probe housings are shown in the product
guide section of our website.
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