U.S. Sensor’s low cost interchangeable glass encapsulated thermistors are manufactured using super stable, precision NTC chips which are hermetically sealed in a glass (DO-35 diode style) package. The result is a device which exhibits excellent long term reliability and stability even when subjected to severe environmental or thermal conditions. Their uniform dimensions and axial lead configuration make them especially suitable for use with automatic insertion equipment.

Features
•	High temperature capability to 300°C	•	High stability
•	Hermetically sealed glass package	•	High voltage insulation
•	Low cost	•	Tinned CCS lead wires are solderable or weldable
		GLASS ENCAPSULATED THERMISTOR  View Photo
Options
•	Special lead forms
•	Non-standard resistance values and tolerances
•	Point matched at specified temperatures
•	Tape and reel packaging

Specifications
•	Thermal time constant: 5 seconds (still air)
•	Thermal time constant: 0.5 seconds (stirred liquid)
•	Dissipation constant: 2 mW/°C (still air)

DO-35 INTERCHANGEABLE GLASS ENCAPSULATED (300°C) ± 0.5°C Accuracy Part Number (±0.5°C 0-100°C ) Resistance Ohms @25°C R-T Curve Beta (K) 0-50°C View R-T Chart 103JL1A 10000 J 3890 203JL1A 20000 J 3890 253JL1A 25000 J 3890 503JL1A 50000 J 3890 104JL1A 100000 J 3890

DO-35 INTERCHANGEABLE GLASS ENCAPSULATED (300°C) ± 1.0°C Accuracy Part Number (±1.0°C 0-100°C ) Resistance Ohms @25°C R-T Curve Beta (K) 0-50°C View R-T Chart 103JM1A 10000 J 3890 203JM1A 20000 J 3890 253JM1A 25000 J 3890 503JM1A 50000 J 3890 104JM1A 100000 J 3890