U.S. Sensor’s low cost glass encapsulated thermistors are manufactured using super stable NTC chips which are hermetically sealed in a glass (DO-35 diode style) package. The result is a device which exhibits excellent long term reliability and stability even when subjected to severe environmental or thermal conditions. Their uniform dimensions and axial lead configuration make them especially suitable for use with automatic insertion equipment.

Features
•	High temperature capability to 300°C	•	High stability
•	Hermetically sealed glass package	•	High voltage insulation
•	Low cost	•	Tinned CCS lead wires are solderable or weldable
		GLASS ENCAPSULATED THERMISTOR  View Photo
Options
•	Special lead forms
•	Non-standard resistance values and tolerances
•	Point matched at specified temperatures
•	Tape and reel packaging

Specifications
•	Thermal time constant: 5 seconds (still air)
•	Thermal time constant: 0.5 seconds (stirred liquid)
•	Dissipation constant: 2 mW/°C (still air)

DO-35 STANDARD GLASS ENCAPSULATED (300°C) Part Number Resistance Ohms @ 25°C * Resistance Tol. ± % R-T Curve Beta (K) 0-50°C View R-T Chart 202FG1K 2000 10 F 3419 252FG1K 2500 10 F 3420 282FG1K 2800 10 F 3419 502FG1K 5000 10 F 3420 822JG1K 8200 10 J 3890 103E1G1K 10000 10 E1 3320 103FG1K 10000 10 F 3419 103GG1K 10000 10 G 3575 103JG1K 10000 10 J 3890 123JG1K 12000 10 J 3890 203JG1K 20000 10 J 3890 253JG1K 25000 10 J 3890 303JG1K 30000 10 J 3890 503JG1K 50000 10 J 3890 753JG1K 75000 10 J 3890 104JG1K 100000 10 J 3890 204JG1K 200000 10 J 3892 254JG1K 250000 10 J 3890 504RG1K 500000 10 R 4140 105RG1K 1000000 10 R 4140

*Resistance tolerances of ± 1%, 2% and 5% are available upon request