U.S. Sensor’s leadless chip thermistor elements are designed for use on hybrid substrates, integrated circuits or printed circuit boards. They have silver metallization on their top and bottom which is suitable for various contact techniques including wire bond, epoxy or solder. Since they are manufactured using the most advanced equipment and technology available, their dimensional parameters are extremely uniform, making the devices especially suitable for use with automatic handling and placement equipment.

 

Features
•	Surface mountable	•	Low cost
•	Small size	•	Rapid response time
•	Very low profile	•	Rated to 150°C
				LEADLESS CHIP THERMISTORS  View Photo
Options
•	Non-standard resistance values and tolerances
•	Special electrode materials (silver or gold)
•	Special dimensions
•	Tape and reel packaging
Specifications
•	Thermal time constant: 2 seconds max
•	Dissipation constant: 1mW/°C

LEADLESS TOP/BOTTOM TERMINATED CHIP THERMISTORS (150°C) Part Number Resistance Ohms @25°C * Resistance Tol. ± % R-T Curve Beta (K) 0-50°C Nominal Dimensions (Inches) Dim. "L    Dim. "W"    Dim. "T" View R-T Chart BC101B1K 100 10 B 2930 0.060 0.060 0.015 BC501B1K 500 10 B 2930 0.025 0.025 0.021 BC102F1K 1000 10 F 3420 0.045 0.045 0.015 BC222J1K 2252 10 J 3890 0.070 0.070 0.010 BC302J1K 3000 10 J 3890 0.065 0.065 0.010 BC502J1K 5000 10 J 3890 0.055 0.055 0.015 BC103J1K 10000 10 J 3890 0.040 0.040 0.015 BC203J1K 20000 10 J 3890 0.030 0.030 0.015 BC303J1K 30000 10 J 3890 0.025 0.025 0.020 BC503J1K 50000 10 J 3890 0.020 0.020 0.020 BC104R1K 100000 10 R 4140 0.022 0.022 0.016